Applied materials introduce 45nm photomask etching technology equipment

Recently, Applied Materials announced the introduction of the advanced AppliedCenturaTetraTM III mask etching device, which is the only nanofabrication technology system currently available to provide 45nm photomask etching. TetraIII controls the depth of the groove to within 10 Ã… by controlling the quartz mask while reducing the critical dimension loss to less than 10 nm, allowing customers to alternate between phase shift masks and powerful optical proximity correction techniques in the most important device layers. The system provides an error-free, high-productivity etch process for next-generation lithography applications based on a variety of new materials such as chrome, quartz, and oxynitride.

Tom St. Dennis, senior vice president of Applied Materials, General Manager of the Etching, Cleaning, Front and Ion Implantation Division, said: "The outstanding performance of the Tetra III system in advanced binary mask and phase shift mask applications is to help customers. The key to achieving 45nm and smaller technology node mask products. As the industry develops some potential next-generation lithography solutions, related applications are also emerging at an unprecedented rate. The TetraIII system is capable of all lithography applications in a variety of Etching is done on different photomask materials."

The ultra-clean and technologically extended platform of the AppliedCenturaTetraIII system allows customers to achieve the highest current output on the most advanced masks.

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